APPLICATION

Cushion Pad for FPCB, IC, LED Module

Hot-pressing cushion pad is a composite material with high-strength and multi-purpose, which is calendered through polymer composites with the core of high heat-resistance and high toughness and hardness reinforced fibers. It can be used in the environment of -70°C to 380°C, which has the properties of high temperature difference, long service life and resistance to ozone, oxygen, light and environmental aging, it is superior to other sub-material.

Neat surface, high dimensional accuracy and clean without bubble.

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