
TPCA SHOW 2025 – Taiwan Printed Circuit Association International Exhibition
"HYC is set to participate in TPCA 2025, a premier international event for the electronics industry,
bringing together the latest technologies and trends from the global PCB and electronic manufacturing sectors."
★ HYC Exhibition Highlights ★
《Silieet Electric-level Hot-Pressing Cushion Pad》
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【High Stability × High Performance × Eco-Friendly Reusability】
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Wide temperature resistance: -70°C to 380°C
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Excellent Flatness, Low Friction, Anti-Static, and High Cleanliness
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Low moisture absorption, Anti-stick, Oil and Solvent Resistance
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Dimensional Stability, Long Lifespan, and Excellent Toughness
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Reusable, Lightweight, and compatible with automated processing
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Uniform heat conduction and pressure distribution for enhanced lamination efficiency and process reliability
【Sustainable Manufacturing × Paperless Innovation × Proven Carbon Reduction】
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Replaces kraft paper, aluminum foil, and steel press plates
➤ Estimated to reduce over 1 million tons of kraft paper usage annually
➤ Prevents the deforestation of over 30 million trees
➤ Saves over 500 million liters of water used in paper production
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Effectively reduces 80% of carbon emissions and material waste
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Supports corporate ESG transformation goals
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Enables digital traceability and improved risk & carbon emission control
【Smart Manufacturing × RFID × Cloud-Based Tracking】
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Embedded RFID chip enables lifecycle and usage tracking
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Compatible with robotic arm automation for transport and inventory
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Enhances traceability and operational transparency
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Reduces manual inventory errors and labor hours
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Drives paperless process and warehouse management,reduce inventory space
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Aligns with Industry 4.0 and smart factory systems
【Made in Taiwan × Reliable Quality × Global Recognition】
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All R&D, manufacturing, and QC processes are localized in Taiwan
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Annual production capacity is 400,000 m², ensuring stable and reliable supply
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Dedicated engineering team offering real-time customization and technical support
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Awarded Gold and Silver Medals at the International Invention Fair in Nuremberg, Germany,
affirming global leadership and innovation
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✅ Applicable Industries: Printed Circuit Board PCB, Copper Clad Laminate CCL,
Composite Material Lamination, Flexible Printed Circuit Board FPCB, Integrated Circuit Card, etc.
★ Invitation ★
Join us in advancing toward a future of Paperless, Low-carbon, Automated, and High-Efficiency Manufacturing.
◆ Contact us in advance for a guided tour.
Silieet - The Optimal Solution for Next-Gen Pressing Applications.

HSIN YUNG CHIEN CO., LTD. (HYC)
◆ Venue: 4F, Hall 1, Taipei Nangang Exhibition Center
◆ Date: October 22–24, 2025
◆ Booth No.: N-1326
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