EXHIBITION
2025-10-16
TPCA SHOW from 22nd – 24th October, 2025

HYC TPCA show Silieet Electric-level Hot-Pressing Cushion Pad

 

TPCA SHOW 2025 – Taiwan Printed Circuit Association International Exhibition

 

"HYC is set to participate in TPCA 2025, a premier international event for the electronics industry,

bringing together the latest technologies and trends from the global PCB and electronic manufacturing sectors."

 

                               ★ HYC Exhibition Highlights

 

《Silieet Electric-level Hot-Pressing Cushion Pad》

 

HYC Silieet Electric-level Hot-Pressing Cushion Pad HYC Silieet Electric-level Hot-Pressing Cushion Pad

 

High Stability × High Performance × Eco-Friendly Reusability

  • Wide temperature resistance: -70°C to 380°C

  • Excellent Flatness, Low Friction, Anti-Static, and High Cleanliness

  • Low moisture absorption, Anti-stick, Oil and Solvent Resistance

  • Dimensional Stability, Long Lifespan, and Excellent Toughness

  • Reusable, Lightweight, and compatible with automated processing

  • Uniform heat conduction and pressure distribution for enhanced lamination efficiency and process reliability

 

Sustainable Manufacturing × Paperless Innovation × Proven Carbon Reduction

  • Replaces kraft paper, aluminum foil, and steel press plates
    ➤ Estimated to reduce over 1 million tons of kraft paper usage annually
    ➤ Prevents the deforestation of over 30 million trees
    ➤ Saves over 500 million liters of water used in paper production

  • Effectively reduces 80% of carbon emissions and material waste

  • Supports corporate ESG transformation goals

  • Enables digital traceability and improved risk & carbon emission control

 

Smart Manufacturing × RFID × Cloud-Based Tracking

  • Embedded RFID chip enables lifecycle and usage tracking

  • Compatible with robotic arm automation for transport and inventory

  • Enhances traceability and operational transparency

  • Reduces manual inventory errors and labor hours

  • Drives paperless process and warehouse management,reduce inventory space

  • Aligns with Industry 4.0 and smart factory systems

 

Made in Taiwan × Reliable Quality × Global Recognition

  • All R&D, manufacturing, and QC processes are localized in Taiwan

  • Annual production capacity is 400,000 m², ensuring stable and reliable supply

  • Dedicated engineering team offering real-time customization and technical support

  • Awarded Gold and Silver Medals at the International Invention Fair in Nuremberg, Germany,  

       affirming global leadership and innovation

 

HYC Silieet Electric-level Hot-Pressing Cushion Pad •	Awarded Gold and Silver Medals at the International Invention Fair in Nuremberg, Germany HYC Silieet Electric-level Hot-Pressing Cushion Pad •	Awarded Gold and Silver Medals at the International Invention Fair in Nuremberg, Germany

 

Applicable Industries: Printed Circuit Board PCB, Copper Clad Laminate CCL,

Composite Material Lamination, Flexible Printed Circuit Board FPCB, Integrated Circuit Card, etc.

 

 

                                              ★ Invitation

Join us in advancing toward a future of Paperless, Low-carbon, Automated, and High-Efficiency Manufacturing.

◆ Contact us in advance for a guided tour.

Silieet - The Optimal Solution for Next-Gen Pressing Applications.

 

HYC Silieet Electric-level Hot-Pressing Cushion Pad booth

 

HSIN YUNG CHIEN CO., LTD. (HYC)
◆ Venue: 4F, Hall 1, Taipei Nangang Exhibition Center
◆ Date: October 22–24, 2025
◆ Booth No.: N-1326

 

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